First of all, FloorVision is a fast, easy to use and highly integrated semiconductor yield management system; it doesn’t require an application (just a web browser so no software needs to be downloaded); you can save your work and come back to it the following day (or share it with a colleague); you can analyse Gigabytes of data in seconds or less; you can set up alerts even for parameteric behaviour and keep track of your manufacturing while travelling…..but to summarize under different headings, here we go as follows:

1. Yield Management Features —- Benefits

* Yield reporting from MES data —- monitoring at a product level
* Drill-down from MES to parametric —- arriving at root cause, often in seconds, from MES
* Smart Yield Algorithms taking rescreen into account —- more accurate conclusions
* User-configurable Exception alerting and reporting —- avoiding big problems later on
* Genealogy Integration to Wafer-level —- discovering fab-related packaged part yield issues

2. Product Engineering Features —- Benefits

* Stacked Binmaps —- analysing bin patterns across many wafers in seconds
* Parametric Trend Analysis including Cp/Cpk —- quickly comparing trends across datalogs
* Die Analysis and Die Yield Analysis —- investigating outliers or x/y co-ordinate yield
* Bin Pattern Analysis —- bringing to light systemic yield loss
* Parametric Analysis of Bins —- understanding bin failures in detail
* Reticle Analysis —- analysing the effect of reticles from Fab & probe on yield, bins & tests
* Comprehensive x/y analysis —- identifying x/y related parametric bevaviour

3. Test Engineering Features —- Benefits

* Test Correlations —- justifying eliminating tests
* Test Time/Delay Analysis —- discovering that index time is an issue
* Gage R&R —- specifying robust test limits in no time
* Array of Multi-site Tools —- finding site issues quickly
* Detailed test charts and stats —- including advanced filtering
* ANOVA: Yield versus Tester, Loadboard etc —- investigating the effects of hardware
* Target Cp/Cpk and Virtual Re-test —- simulating new test limits
* Characterization —- discovering worst case conditions for each test
* Test Coverage Optimizer —- computing which minimal test set will detect all the failures

4. QA and Reliability —- Benefits

* Outlier Analysis —- improving reliability by understanding outliers
* PAT —- implementing Parts Average Testing
* Drift Analysis for Burn-in and Reliability —- tracking die & population drift
* GDBN Analysis —- highlighting potentially unreliable die
* Outlier Exceptions —- emailed alerts if there are outliers in a datalog
* Genealogy Correlation —- correlating outliers in Test or Probe with Fab parameters